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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/31 tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com datashee t serial eeprom series standard eeprom spi bus eeprom br25sxxx-w series (32k 64k 128k 256k) general description br25sxxx - w series is a serial eeprom of spi bus interface method features ? high speed clock action up to 20mhz (max.) ? wait function by holdb terminal ? part or whole of memory arrays settable as read only memory area by program ? 1.7v to 5.5v single power source action most suitable for battery use ? page write mode useful for initial value write at factory shipment ? highly reliable connection by au pad and au wire ? for spi bus interface (cpol, cpha) = (0, 0), (1, 1) ? auto erase and auto end function at data rewrite ? low current consumption ? at write action (5v) : 1.5ma (typ.) ? at read action (5v) : 1.0ma (typ.) ? at standby action (5v) : 0.1 a (typ.) ? address auto increment function at read action ? write mistake prevention function ? write prohibition at power on ? write prohibition by command code (wrdi) ? write prohibition by wp pin ? write prohibition block setting by status registers (bp1, bp0) ? write mistake prevention function at low voltage ? data kept for 40 years ? data rewrite up to 1,000,000 times ? data at shipment memory array: ffh status register: wpen, bp1, bp0 : 0 packages w(typ.) x d(typ.) x h(max.) page write page 32byte 64byte part number br25s320-w br25s640-w br25s128-w br25s256-w br25sxxx-w series capacity bit format power source voltage sop8 sop-j8 ssop-b8 tssop-b8 msop8 tssop-b8j vson008 x2030 32kbit 4k 8 1.7v to 5.5v 64kbit 8k 8 1.7v to 5.5v 128kbit 16k 8 1.7v to 5.5v 256kbit 32k 8 1.7v to 5.5v v son008x2030 2.00mm x 3.00mm x 0.60mm tssop-b8 3.00mm x 6.40mm x 1.20mm sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1.65mm tssop-b8j 3.00mm x 4.90mm x 1.10mm msop8 2.90mm x 4.00mm x 0.90mm ssop-b8 3.00mm x 6.40mm x 1.35mm downloaded from: http:///
datasheet 2/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com absolute maximum ratings (ta=25 ) parameter symbol ratings unit remarks supply voltage v cc -0.3 to +6.5 v 450 (sop8) when using at ta=25 or higher 4.5mw to be reduced per 1 . 450 (sop-j8) when using at ta=25 or higher 4.5mw to be reduced per 1 . 300 (ssop-b8) when using at ta=25 or higher 3.0mw to be reduced per 1 . 330 (tssop-b8) when using at ta=25 or higher 3.3mw to be reduced per 1 . 310 (tssop-b8j) when using at ta=25 or higher 3.1mw to be reduced per 1 . 310 (msop8) when using at ta=25 or higher 3.1mw to be reduced per 1 . power dissipation pd 300 (vson008x2030) mw when using at ta=25 or higher 3.0mw to be reduced per 1 . storage temperature tstg 65 to +125 operating temperature topr 40 to +85 terminal voltage \ -0.3 to vcc+0.3 v memory cell characteristics (ta=25c , vcc=1.7v to 5.5v) limits parameter min. typ. max. unit number of data rewrite times *1 1,000,000 - - times data hold years *1 40 - - years *1 not 100% tested recommended operating ratings parameter symbol ratings unit power source voltage vcc 1.7 to 5.5 input voltage v in 0 to vcc v input / output capacity (ta=25c, frequency=5mhz) parameter symbol min. max. unit conditions input capacity *1 c in 8 v in =gnd output capacity *1 c out 8 pf v out =gnd *1 not 100% tested. electrical characteristics (unless otherwise specified, ta=-40c to +85c, vcc=1.7v to 5.5v) limits parameter symbol min. typ. max. unit conditions h input voltage1 vih1 0.7xvcc vcc+0.3 v 1.7 vcc 5.5v l input voltage1 vil1 -0.3 0.3xvcc v 1.7 vcc 5.5v l output voltage1 vol1 0 0.4 v iol=2.1ma, 2.5 vcc<5.5v l output voltage2 vol2 0 0.2 v iol=1.0ma, 1.7 vcc<2.5v h output voltage1 voh1 vcc-0.2 vcc v ioh=-0.4ma, 2.5v vcc<5.5v h output voltage2 voh2 vcc-0.2 vcc v ioh=-100a, 1.7 vcc<2.5v input leakage current ili -1 1 av in =0 to vcc output leakage current ilo -1 1 av out =0 to vcc, csb=vcc 0.5 *1 icc1 1 *2 ma vcc=1.8v, fsck=5mhz, te/w=5ms byte write, page write, write status register 1 *1 icc2 1.5 *2 ma vcc=2.5v, fsck=10mhz, te/w=5ms byte write, page write, write status register 2 *1 operating current write icc3 3 *2 ma vcc=5.5v, fsck=20mhz, te/w=5ms byte write, page write, write status register icc4 1 ma vcc=1.8v, fsck=5mhz, so=open read, read status register icc5 1 ma vcc=2.5v, fsck=2mhz, so=open read, read status register icc6 1.5 ma vcc=2.5v, fsck=5mhz, so=open read, read status register icc7 2 ma vcc=2.5v, fsck=10mhz, so=open read, read status register icc8 2 ma vcc=5.5v, fsck=5mhz, so=open read, read status register icc9 4 ma vcc=5.5v, fsck=10mhz, so=open read, read status register operating current read icc10 8 ma vcc=5.5v, fsck=20mhz, so=open read, read status register standby current isb 2 a vcc=5.5v, so=open csb=holdb=wp=vcc, sck=si=vcc or gnd *1 br25s320/640-w *2 br25s128/256-w downloaded from: http:///
datasheet 3/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com operating timing characteristics (ta=-40c to +85c, unless otherwise specified, load capacity c l =30pf) 1.7 vcc<2.5v 1.8 vcc<2.5v 2.5 vcc<4.5v 4.5 vcc<5.5v parameter symbol min. typ. max. min. typ. max. min. typ. max. min. typ. max. unit sck frequency f sck - - 3 - - 5 - - 10 - - 20 mhz sck high time t sckwh 125 - - 80 - - 40 - - 20 - - ns sck low time t sckwl 125 - - 80 - - 40 - - 20 - - ns csb high time t cs 250 - - 90 - - 40 - - 20 - - ns csb setup time t css 100 - - 60 - - 30 - - 15 - - ns csb hold time t csh 100 - - 60 - - 30 - - 15 - - ns sck setup time t scks 100 - - 50 - - 20 - - 15 - - ns sck hold time t sckh 100 - - 50 - - 20 - - 15 - - ns si setup time t dis 30 - - 20 - - 10 - - 5 - - ns si hold time t dih 50 - - 20 - - 10 - - 5 - - ns data output delay time t pd - - 125 - - 80 - - 40 - - 20 ns output hold time t oh 0 - - 0 - - 0 - - 0 - - ns output disable time t oz - - 200 - - 80 - - 40 - - 20 ns holdb setting setup time t hfs 100 - - 0 - - 0 - - 0 - - ns holdb setting hold time t hfh 100 - - 20 - - 10 - - 5 - - ns holdb release setup time t hrs 100 - - 0 - - 0 - - 0 - - ns holdb release hold time t hrh 100 - - 20 - - 10 - - 5 - - ns time from holdb to output high-z t hoz - - 100 - - 80 - - 40 - - 20 ns time from holdb to output change t hpd - - 100 - - 80 - - 40 - - 20 ns sck rise time *1 t rc - - 1 - - 1 - - 1 - - 1 s sck fall time *1 t fc - - 1 - - 1 - - 1 - - 1 s output rise time *1 t ro - - 100 - - 50 - - 40 - - 20 ns output fall time *1 t fo - - 100 - - 50 - - 40 - - 20 ns write time t e/w - - 5 - - 5 - - 5 - - 5 ms *1 not 100% tested ac timing characteristics conditions limits parameter symbol min. typ. max. unit load capacity c l - - 30 pf input rise time - - - 50 ns input fall time - - - 50 ns input voltage - 0.2vcc/0.8vcc v input / output judgment vo ltage - 0.3vcc/0.7vcc v sync data input / output timing figure 1. input timing csb sck si so tcs tcss tscks tsckwl tsckwh tdis tdih trc tfc high-z si is taken into ic inside in sync with data rise edge of sck. input address and data from the most significant bit msb figure 2. input / output timing csb sck si so tpd toh tro,tfo toz tcsh tsckh tcs hi g h-z figure 3. hold timing csb sck si n+1 "h" "l" n dn n-1 dn dn-1 holdb so dn+1 thfs thfh thoz thrs thrh tdis thpd high-z so is output in sync with data fall edge of sck. data is output from the most significant bit msb. downloaded from: http:///
datasheet 4/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com block diagram pin configuration pin descriptions terminal name input /output function vcc - power source to be connected gnd - all input / output reference voltage, 0v csb input chip select input sck input serial clock input si input start bit, ope code, ad dress, and serial data input so output serial data output holdb input hold input command communications may be suspended temporarily (hold status) input write protect input write command is prohibited write status register command is prohibited *1 12bit: br25s320-w 13bit: br25s640-w 14bit: br25s128-w 15bit: br25s256-w to t to t * t to t * (top view) vcc holdb sck si csb so wp gnd br 25s320 -w br 25s640 -w br25s128 -w br 2 5s256 -w wp downloaded from: http:///
datasheet 5/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 6. "l" output vol t age vol1(vcc=2.5v) figure 7. "h" output voltage voh1 (vcc=2.5v) figure 4. "h" input voltage vih (csb,sck,si,holdb,wp) figure 5. "l" input voltage vil (csb,sck,si,holdb,wp) typical performance curves (the following characteristic data are typ. values.) downloaded from: http:///
datasheet 6/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 8. input leak current ili (csb,sck,si,holdb,wp) figure 9. output leak current ilo (so) figure 11. current consumption at write operation icc3 (br25s128/256-w) figure 10. current consumpt ion at write operation icc3 (br25s320/640-w) typical performance curves \ continued downloaded from: http:///
datasheet 7/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 12. current consumption at read operation icc10 figure 14. sck frequency fsck figure 15. sck high time tsckwh figure 13. current consumpt ion at standby operation isb typical performance curves \ continued downloaded from: http:///
datasheet 8/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 16. sck low time tsckwl figure 17. csb high time tcs figure 18. csb setup time tcss figure 19. csb hold time tcsh typical performance curves \ continued downloaded from: http:///
datasheet 9/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 20. si setup time tdis figure 21. si hold time tdih figure 22. data output delay time tpd figure 23. output disable time toz typical performance curves \ continued downloaded from: http:///
datasheet 10/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 24. holdb setti ng hold time thfh figure 25. holdb release hold time thrh figure 26. time from holdb to output high-z thoz figure 27. time from holdb to output change thpd typical performance curves \ continued downloaded from: http:///
datasheet 11/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 30. w r ite cycle time te/w figure 28. output rise time tro figure 29. output fall time tfo typical performance curves \ continued downloaded from: http:///
datasheet 12/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com features status registers this ic has status register. the status register expresses the following parameters of 8 bits. bp0 and bp1 can be set by write status register command. t hese 2 bits are memorized in to the eeprom, therefore are valid even when power source is turned off. rewrite characteristics and data hold time ar e same as characteristics of the eeprom. wen can be set by write enable command and write disable command. wen becomes write disable status when power source is turned off. r/b is for write conf irmation, therefore cannot be set externally. the value of status register can be read by read status register command. 1. contexture of status register product number bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 br25s320-w br25s640-w br25s128-w br25s256-w wpen 0 0 0 bp1 bp0 wen r D /b bit memory location function wpen eeprom wp pin enable / disable designation bit wpen=0=invalid wpen=1=valid bp1 bp0 eeprom eeprom write disabl e block designation bit wen registers write and write status register write enable / disable status confirmation bit wen=0=prohibited wen=1=permitted r D /b registers write cycle status (ready / busy) status confirmation bit r D /b=0=ready r D /b=1=busy 2. write disable block setting write disable block bp1 bp0 br25s320-w br25s640-w br25s128-w br25s256-w 0 0 none none none none 0 1 c00h-fffh 1800h-1fffh 3000h-3fffh 6000h-7fffh 1 0 800h-fffh 1000h-1fffh 2000h-3fffh 4000h-7fffh 1 1 000h-fffh 0000h-1fffh 0000h-3fffh 0000h-7fffh wp pin by setting wp=low, write command is prohibited. and the write command to be disabled at this moment is wrsr. however, when write cycle is in execution, no interruption can be made. product number wrsr write br25s320-w br25s640-w br25s128-w br25s256-w prohibition possible but wpen bit 1 prohibition impossible holdb pin by holdb pin, data transfer can be interrupted. when sck=0 , by making holdb from 1 into0, data transfer to eeprom is interrupted. when sck = 0, by making holdb from 0 into 1, data transfer is restarted. downloaded from: http:///
datasheet 13/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com command mode command contents ope code wren write enable command 0000 0110 wrdi write disable command 0000 0100 read read command 0000 0011 write write command 0000 0010 rdsr read status register command 0000 0101 wrsr write status register command 0000 0001 timing chart 1. write enable (wren) / disable (wrdi) command this ic has write enable status and write disable status. it is set to write enable status by write enable command, and it is set to write disable status by write disable command. as for these commands, set csb low, and then input the respective ope codes. the respective commands are accepted at the 7-th clock rise. even with input over 7 clocks, command becomes valid. when to carry out write command, it is necessary to set write enable status by the write enable command. if write command is input in the write disable st atus, the command is cancel led. and even in the writ e enable status, once write command is executed, it gets in the wr ite disable status. after power on, this ic is in write disable status. 2. read command (read) product number address length br25s320-w a11-a0 br25s640-w a12-a0 br25s128-w a13-a0 br25s256-w a14-a0 by read command, data of eeprom can be read. as for th is command, set csb low, then input address after read ope code. eeprom starts data output of the designated address. da ta output is started from sc k fall of 23-th clock, and from d7 to d0 sequentially. this ic has increment read functi on. after output of data for 1 byte (8bits), by continuing input of sck, data of the next address can be read. increment r ead can read all the addresses of eeprom. after reading data of the most significant address, by continuing increment read, data of t he most insignificant address is read. wren (write enable): write enable figure 31. write enable command -z figure 32. write disable command wrdi (write disable): write disable -z high-z 11 1 1 0 0 3 7 1 2 d6 so csb sck si 4 5 a12 6 8 * a0 a1 d7 23 30 24 d0 0 0 0 0 0 d2 d1 9 10 a13 a14 30 31 figure 33. read command downloaded from: http:///
datasheet 14/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 3. write command (write) by write command, data of eeprom can be written. as fo r this command, set csb low, then input address and data after write ope code. then, by making csb high, the eeprom starts writing. the write time of eeprom requires time of te/w (max 5ms). during te/w, other than read status register command is not accepted. set csb high between taking the last data (d0) and rising the next sck clock. at the other timing, write command is not executed, and this write command is cancelled. this ic has page write function, and after input of data for 1 byte (8 bits), by continuing data input without setting csb high, 2byte or more data can be written for one te/w. the maximum number of write bytes is specified per device of each capacity. up to 64 arbitrary bytes can be written (in the case of br25s128/256-w). in page write, the insignificant 5 bit of the designated address is incremented internal ly at every time when data of 1 byte is input and data is written to respective addresses. when data of t he maximum bytes or higher is input, address rolls over, and previously input data is overwritten. 4. write status register, read st atus register command (wrsr/rdsr) write status register command can write data of status register. the data can be wr itten by this command are 3 bits, that is, wpen(bit7), bp1 (bit3) and bp0 (bit2) among 8 bits of status register. by bp1 and bp0, write disable block of eeprom can be set. as for this command, set csb low, and in put ope code of write status register, and input data. then, by making csb high, eeprom starts writing. write time re quires time of te/w as same as write. as for csb rise, set csb high between taking the last data bit (bit0) and t he next sck clock rising. at the other timing, command is cancelled. write disable block is determined by bp1 bp0, and the block can be selected from 1/4 , 1/2, and entire of memory array (refer to the write disable block setting table.). to the write disabled block, write cannot be made, and only read can be made. product number address length br25s320-w a11-a0 br25s640-w a12-a0 br25s128-w a13-a0 br25s256-w a14-a0 high-z =don't care 31 d0 0 0 0 0 0 d2 d1 d7 23 30 24 d6 0 a0 a1 * 1 1 2 4 0 csb sck si so 0 3 7 8 5 6 a12 11 9 10 a13 a14 figure 34. write command csb sck high-z *=don't care 0 0 0 0 1 wpen 0 1 2 4 0 si so 0 3 7 8 5 6 * 9 10 11 12 13 14 15 * * bp1 bp0 * * bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 0 figure 35. write status register figure 36. read status register command high-z bit7 bit6 bit5 bit4 0 0 0 bit3 bit2 bit1 bit0 13 csb sck si 1 1 10 6 0 so 14 1 2 wen r/b 11 15 3 7 9 0 5 12 0 0 0 0 0 4 8 wpen bp1 bp0 downloaded from: http:///
datasheet 15/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com wp cancel valid area wp is normally fixed to h or l for use, but when wp is controlled so as to cancel write status register command, pay attention to the following wp valid timing. while write status register command is executed, by setting wp = l in cancel valid area, command can be cancelled. the area from command ope code to csb rise at internal automatic write start becomes the cancel valid area. however, once write is started, by any input write cycle cannot be cancel led. wp input becomes dont care, and cancellation becomes invalid. holdb pin by holdb pin, command communication can be stopped tempor arily (hold status). the command communications are carried out when the holdb pin is high. to get in hold status, at command communication, when sck=low, set the holdb pin low. at hold status, sck and si become dont care, and so becomes high impedance (high-z). to release the hold status, set the holdb pin high when sck=low. after that, communication can be restarted from the point before the hold status. for example, when hold status is made after a5 address input at read, after release of hold status, by starting a4 address input, read can be restar ted. when in hold status, k eep csb low. when it is set csb=high in hold status, the ic is reset, theref ore communication after that cannot be restarted. figure 37. wp valid timing (at inputting wrsr command) 6 7 ope code data te/w data write time sck 15 16 valid (wrsr command is reset by wpb=l) invalid downloaded from: http:///
datasheet 16/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com method to cancel each command read, rdsr ? method to cancel : cancel by csb = h. write page write a ope code or address input area cancellation is available by csb=h. b data input area (d7 to d1 input area) cancellation is available by csb=h. c data input area (d0 area) in this area, cancellation is not available. when csb is set high, write starts. d te/w area in the area c, by rising csb, write starts. while writing, by any input, cancellation cannot be made. note1) if vcc is made off during write ex ecution, designated address data is not guar anteed, therefore wr ite it once again. note2) if csb is rised at the same timing as that of the sck rise, write execution / c ancel becomes unstable, therefore, it is recommended to rise in sck = l area. as for sck rise, assure timing of tc ss / tcsh or more. wrsr a from ope code to 15-th clock rise cancellation is available by csb=h. b from 15-th clock rise to 16-th clock rise (write enable area) in this area, cancellation is not available. when csb is set high, write starts. c after 16-th clock rise. cancellation is available by csb=h. however, if write starts (csb is rised) in the area b, cancellation cannot be made by any means. and, by inputting on sck clock, cancellation cannot be made. note1) if vcc is made off during write ex ecution, designated address data is not guaranteed, therefor e write it once again note2) if csb is rised at the same timing as that of the sck rise, write execution / cancel becomes unst able, therefore, it is recommended to rise in sck = l area. as for sck rise, assure timing of tcss / tcsh or more. wren/wrdi a f rom ope code to 7-th clock rise, cancellation is available by csb = h. b cancellation is not available 7-th clock. figure 38. read cancel valid timing figure 39. rdsr cancel valid timing figure 42. wren/wrdi cancel valid timing ope code address a data te/w b d c 8bits 8bits 16bits d7 b d6 d5 d4 d3 d2 d1 d0 sck si c figure 41. wrsr cancel valid timing ope code address cancel available in all areas of read mode data 8 bits 8 bits 16 bits ope code cancel available in all areas of rdsr mode data 8 bits 8 bits ope code data te/w 8 bits 14 15 16 17 d1 d0 a b c 8 bits a b c sck si ope code 8 bits 6 7 8 a b sck figure 40. write cancel valid timing downloaded from: http:///
datasheet 17/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com i/o peripheral circuits in order to realize stable high speed operations, pay a ttention to the following input / output pin conditions. input pin pull up, pull down resistance when to attach pull up, pull down resistance to eeprom input pin, select an appropriate value for the microcontroller vol, iol with considering vil characteristics of this ic. 1. pull up resistance and, in order to prevent malfunction or erroneous write at power on/off, be sure to make csb pull up. 2.pull down resistance further, by amplitude vihe, vile of signal input to eeprom, operation speed changes. by inputting vcc/gnd level amplitude of signal, more stable high speed operations can be realized. on the cont rary, when amplitude of 0.8v cc / 0.2vcc is input, operation speed becomes slow. *1 in order to realize more stable high speed operati on, it is recommended to make the values of r pu , r pd as large as possible, and make the amplitude of signal input to eeprom close to the amplitude of v cc / gnd level. ( * 1 in this case, guaranteed value of operating timing is guaranteed.) so load capacity condition load capacity of so output pin affects upon delay characterist ic of so output (data output delay time, time from holdb to high-z, output rise time, output fall time.). in order to make output delay char acteristic into better, make so load capacity small. other cautions make the each wire length from the microcontroller to eepro m input pin same length, in order to prevent setup / hold violation to eeprom, owing to difference of wire length of each input. eeprom so c l figure 45. so load capacity figure 43. pull up resistance figure 44. pull down resistance r pd v ohm i ohm ??? v ohm v ihe ??? example) when v cc =5v, v ohm =v cc -0.5v, i ohm 0.4ma, v ihe =v cc 0.7v, from the equation , r pd 5 0.5 0.410 - 3 r pd 11.3[k ] r pu v cc v olm i olm ??? v olm v ile ??? r pu 5 0.4 210 - 3 r pu 2.3[k ] with the value of rpu to satisfy the above equation, v olm becomes 0.4v or lower, and with v ile (=1.5v), the equation is also satisfied. ? v ile :eeprom v il specifications ? v olm :microcontroller v ol specifications ? i olm :microcontroller i ol specifications example) when vcc=5v, v ile =1.5v, v olm =0.4v, i olm =2ma, from the equation , i olm v ile v olm l output l input microcontroller eeprom r pu i ohm v ihe v ohm microcontroller eeprom h output h input r pd downloaded from: http:///
datasheet 18/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com equivalent circuit output circuit input circuit wp internal signal figure 50. holdb input equivalent circuit figure 51. wp input equivalent circuit figure 46. so output equivalent circuit figure 47. csb input equivalent circuit figure 48. sck input equivalent circuit figure 49. si input equivalent circuit so internal signal internal signal csb internal signal internal signal sck internal signal holdb internal signal si internal signal downloaded from: http:///
datasheet 19/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com notes on power on/off at standby set csb h, and be sure to set sck, si input l or h. do not input intermediate electric potantial. at power on/off when vcc rise or fall, set csb=h (=vcc). when csb is l, this ic gets in input ac cept status (active). if power is turned on in this status, noises and the likes may cause malfunction, erroneous write or so . to prevent these, at power on, set c sb h. (when csb is in h status, all inputs are canceled.) (good example) csb terminal is pulled up to vcc. at power off, take 10ms or more before supply. if power is turned on without observing this condition, the ic internal circuit may not be reset. (bad example) csb terminal is l at power on/off. in this case, csb always becomes l (active status), and eeprom may have malfunction or erroneous write owing to noises and the likes. even when csb input is high-z, the status becomes like this case. operating timing after power on as shown in figure 53, at standby, when sck is h, even if c sb is fallen, si status is not read at fall edge. si status is read at sck rise edge after fall of csb. at standby and at power on/off, set csb h status. at power on malfunction preventing function this ic has a por (power on reset) circuit as mistake writ e countermeasure. after por acti on, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. when power is on, if the recommended conditions of the following tr, toff, and vbot are not satisfied, it may become write enable status owing to noises and the likes. recommended conditions of t r , t off , vbot t r t off v bot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below low voltage malfunction preventing function lvcc (vcc-lockout) circuit prevents data rewrite ac tion at low power, and prevents wrong write. at lvcc voltage (typ. =1.2v) or below, it prevent data rewrite. tr toff vbot 0 vcc figure 52. csb timing at power on/off csb vcc bad example good example figure 54. rise waveform figure 53. operating timing 0 1 2 command start here. si is read. even if csb is fallen at sck=h, si status is not read at that edge. csb sck si downloaded from: http:///
datasheet 20/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com noise countermeasures vcc noise (bypass capacitor) when noise or surge gets in the power source line, malfunc tion may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (0.1 f) between ic vcc and gnd. at that ti me, attach it as close to ic as possible. and, it is also recommended to attach a bypass capacitor between board vcc and gnd. sck noise when the rise time of sck (trc) is long, and a certain degr ee or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circuit is built in sck input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sck input, set the noise amplit ude 0.2vp-p or below. and it is recommended to set the rise time of sck (trc) 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. wp noise during execution of write status regist er command, if there exist noises on wp pin, mistake in recognition may occur and forcible cancellation may result. to avoid this, a schmitt trigger circuit is built in wp input. in the same manner, a schmitt trigger circuit is built in csb in put, si input and holdb input too. notes for use (1) described numeric values and data are design repres entative values, and the values are not guaranteed. (2) we believe that application circuit examples are recommendabl e, however, in actual use, confirm characteristics further sufficiently. in the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluct uations of external parts and our lsi. (3) absolute maximum ratings if the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded, lsi may be destructed. do not impress voltage and temperatur e exceeding the absolute maximum ratings. in the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to lsi. (4) gnd electric potential set the voltage of gnd terminal lowest at any action condition. make sure that each terminal voltage is higher than that of gnd terminal. (5) heat design in consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin. (6) terminal to terminal short circuit and wrong packaging when to package lsi onto a board, pay sufficient attention to lsi direction and disp lacement. wrong packaging may destruct lsi. and in the case of short circuit between lsi terminals and terminals and power source, terminal and gnd owing to foreign matter, lsi may be destructed. (7) use in a strong electromagnetic field may cause malfunction, therefore, ev aluate design sufficiently. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. downloaded from: http:///
datasheet 21/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com ordering information product code description b r 2 5 s x x x x x x - w x x bus type 25 spi operating temperature -40 to+85 capacity 32=32k 256=256k 64=64k 128=128k package f :sop8 fj :sop-j8 fv : ssop-b8 fvt : tssop-b8 fvj : tssop-b8j fvm : msop8 nux : vson008x2030 double cell packaging and forming specification e2 : embossed tape and reel (sop8, sop-j8, ssop-b8,tssop-b8, tssop-b8j) tr : embossed tape and reel (msop8, vson008x2030) lineup package capacity type quantity sop8 sop-j8 ssop-b8 reel of 2500 tssop-b8 reel of 3000 tssop-b8j reel of 2500 msop8 reel of 3000 32k vson008x2030 reel of 4000 sop8 sop-j8 ssop-b8 reel of 2500 tssop-b8 reel of 3000 tssop-b8j reel of 2500 64k msop8 reel of 3000 sop8 sop-j8 ssop-b8 reel of 2500 128k tssop-b8 reel of 3000 sop8 256k sop-j8 reel of 2500 downloaded from: http:///
datasheet 22/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet 23/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet 24/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) ssop-b8 0.08 m 0.3min 0.65 (0.52) 3.0 0.2 0.15 0.1 (max 3.35 include burr) s s 0.1 1234 5 6 7 8 0.22 6.4 0.3 4.4 0.2 +0.06 0.04 0.1 1.15 0.1 ssop-b8 downloaded from: http:///
datasheet 25/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued tssop-b8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
datasheet 26/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued tssop-b8j direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () 1pin downloaded from: http:///
datasheet 27/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet 28/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued vson008x2030 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 4000pcs tr () direction of feed reel 1pin downloaded from: http:///
datasheet 29/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com marking diagrams msop8(top view) part number marking lot number 1pin mark part number marking sop8(top view) lot number 1pin mark sop-j8(top view) part number marking lot number 1pin mark tssop-b8j(top view) part number marking lot number 1pin mark vson008x2030 (top view) part number marking lot number 1pin mark tssop-b8(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark downloaded from: http:///
datasheet 30/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com marking information capacity product name marking package type s320 sop8 s320 sop-j8 s320 ssop-b8 s320 tssop-b8 s320 tssop-b8j s320 msop8 32k s320 vson008x2030 s640 sop8 s640 sop-j8 s640 ssop-b8 s640 tssop-b8 s640 tssop-b8j 64k s640 msop8 5s128 sop8 5s128 sop-j8 s128 ssop-b8 128k 5s128 tssop-b8 5s256 sop8 256k 5s256 sop-j8 downloaded from: http:///
datasheet 31/31 br25sxxx-w series (32k 64k 128k 256k) tsz02201-0r2r0g100330-1-2 21.aug.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com revision history date revision changes 21.aug.2012 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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